Sensor chip and electronic apparatus

ABSTRACT

A sensor chip includes: a pixel array unit that has a rectangular-shaped area in which a plurality of sensor elements are arranged in an array pattern; and a global control circuit, in which driving elements simultaneously driving the sensor elements are arranged in one direction, and each of the driving elements is connected to a control line disposed for each one column of the sensor elements, that is arranged to have a longitudinal direction to be along a long side of the pixel array unit. For example, the present technology can be applied to ToF sensor.

CROSS REFERENCE TO RELATED APPLICATIONS

The present Application is a 371 National State Entry of InternationalApplication No.: PCT/JP2018/030905, filed on Aug. 22, 2018, which inturn claims benefit of U.S. patent application Ser. No. 15/695,400,filed on Sep. 5, 2017, the entire contents of which are incorporatedherein by reference.

TECHNICAL FIELD

The present disclosure relates to a sensor chip and an electronicapparatus, and more particularly, to a sensor chip and an electronicapparatus capable of performing control at a higher speed.

BACKGROUND ART

Recently, sensor chips of a complementary metal oxide semiconductor(CMOS) image sensor, a time of flight (ToF) sensor, a fluorescenceemission detection sensor, and the like are requested to perform controlat a high speed.

For example, in a sensor chip that is requested to perform high-speeddriving exceeding a frame rate of 1 Mfps, it is necessary to control apulse of a control signal in order of sub μ seconds or 10 n seconds.

For example, in PTL 1, a ToF sensor capable of immediately performingsignal processing for tracing an object measured in a three-dimensionalimage and the like by randomly outputting measured information isdisclosed.

CITATION LIST Patent Literature

[PTL 1]

JP 2012-049547A

SUMMARY Technical Problem

However, in a case where a driving element driving a sensor elementincluded in a sensor chip as described above is arranged to be away fromthe sensor element, it is difficult to perform high-speed control due tothe influences of a delay of a control signal used for driving thesensor element, a slew rate, and the like.

The present disclosure is made in consideration of the state, and iscapable of performing control at a high speed.

Solution to Problem

A sensor chip of one aspect of the present disclosure includes: pixelarray unit that has a rectangular-shaped area in which a plurality ofsensor elements are arranged in an array pattern; and global controlcircuit, in which driving elements simultaneously driving the sensorelements are arranged in one direction, and each of the driving elementsis connected to a control line disposed for each one column of thesensor elements, that is arranged to have a longitudinal direction to bealong a long side of the pixel array unit.

An electronic apparatus of one aspect of the present disclosureincluding a sensor chip including: a pixel array unit that has arectangular-shaped area in which a plurality of sensor elements arearranged in an array pattern; and a global control circuit, in whichdriving elements simultaneously driving the sensor elements are arrangedin one direction, and each of the driving elements is connected to acontrol line disposed for each one column of the sensor elements, thatis arranged to have a longitudinal direction to be along a long side ofthe pixel array unit.

According to one aspect of the present disclosure, a pixel array unit isan area having a rectangular shape in which a plurality of sensorelements are arranged in an array pattern, and, in a global controlcircuit, driving elements simultaneously driving the sensor elements arearranged in one direction, the longitudinal direction thereof isarranged along a long side of the pixel array unit, and each of thedriving elements is connected to a control line disposed for each onecolumn of the sensor elements.

Advantageous Effects of Invention

According to one aspect of the present disclosure, higher-speed controlcan be performed.

Note that the effects described here are not necessarily limited, butany one of effects described in the present disclosure may be acquired.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram that illustrates an example of theconfiguration of a sensor chip according to a first embodiment of thepresent technology.

FIGS. 2A to 2C are diagrams that illustrate examples of theconfiguration of a global control circuit.

FIGS. 3A and 3B are diagrams that illustrate examples of theconfiguration of a rolling control circuit.

FIG. 4 is a block diagram that illustrates a first modified example ofthe sensor chip illustrated in FIG. 1.

FIG. 5 is a block diagram that illustrates a second modified example ofthe sensor chip illustrated in FIG. 1.

FIG. 6 is a block diagram that illustrates an example of theconfiguration of a sensor chip according to a second embodiment.

FIG. 7 is a perspective view that illustrates an example of theconfiguration of a sensor chip according to a third embodiment.

FIG. 8 is a block diagram that illustrates an example of theconfiguration of the sensor chip according to the third embodiment.

FIG. 9 is a block diagram that illustrates a first modified example ofthe sensor chip illustrated in FIG. 8.

FIG. 10 is a block diagram that illustrates a second modified example ofthe sensor chip illustrated in FIG. 8.

FIG. 11 is a block diagram that illustrates as example of theconfiguration of a sensor chip according to a fourth embodiment.

FIG. 12 is a block diagram that illustrates an example of theconfiguration of a sensor chip according to a fifth embodiment.

FIG. 13 is a perspective view that illustrates an example of theconfiguration of a sensor chip according to a sixth embodiment.

FIG. 14 is a block diagram that illustrates an example of theconfiguration of a sensor chip according to the sixth embodiment.

FIG. 15 is a block diagram that illustrates a first modified example ofthe sensor chip illustrated in FIG. 14.

FIG. 16 is a block diagram that illustrates a second modified example ofthe sensor chip illustrated in FIG. 14.

FIG. 17 is a block diagram that illustrates a third modified example ofthe sensor chip illustrated in FIG. 14.

FIG. 18 is a block diagram that illustrates a fourth modified example ofthe sensor chip illustrated in FIG. 14.

FIG. 19 is a block diagram that illustrates a fifth modified example ofthe sensor chip illustrated in FIG. 14.

FIG. 20 is a block diagram that illustrates a sixth modified example ofthe sensor chip illustrated in FIG. 14.

FIG. 21 is a block diagram that illustrates a seventh modified exampleof the sensor chip illustrated in FIG. 14.

FIG. 22 is a block diagram that illustrates an eighth modified exampleof the sensor chip illustrated in FIG. 14.

FIG. 23 is a perspective view that illustrates an example of theconfiguration of a sensor chip according to a seventh embodiment.

FIG. 24 is a perspective view that illustrates a first modified exampleof the sensor chip illustrated in FIG. 23.

FIG. 25 is a perspective view that illustrates a second modified exampleof the sensor chip illustrated in FIG. 23.

FIGS. 26A to 26E are block diagrams that illustrate examples of theconfiguration of a sensor chip according to an eighth embodiment andmodified examples thereof.

FIG. 27 is a block diagram that illustrates an example of theconfiguration of an imaging apparatus.

FIG. 28 is a diagram that illustrates an example of a use for using animage sensor.

FIG. 29 is a diagram that illustrates an example of a schematicconfiguration of an endoscope operation system.

FIG. 30 is a block diagram that illustrates an example of the functionalconfiguration of a camera head and a CCU.

FIG. 31 is a block diagram that illustrates an example of a schematicconfiguration of a vehicle control system.

FIG. 32 is an explanatory diagram that illustrates an example ofinstallation positions of a vehicle external information detecting unitand an imaging unit.

DESCRIPTION OF EMBODIMENTS

Hereinafter, specific embodiments of the present technology will bedescribed in detail with reference to the drawings.

<First Configuration Example of Sensor Chip>

FIG. 1 is a block diagram that illustrates an example of theconfiguration of a sensor chip according to a first embodiment of thepresent technology.

As illustrated in FIG. 1, the sensor chip 11 has a configuration inwhich a pixel array unit 12, a global control circuit 13, a rollingcontrol circuit 14, a column analog-to-digital converter (ADC) 15, andan input/output unit 16 are arranged on a semiconductor substrate.

The pixel array unit 12 is a rectangular-shaped area in which varioussensor elements according to the function of the sensor chip 11, forexample, photoelectric conversion elements performing photoelectricconversion of light are arranged in an array pattern. In the exampleillustrated in FIG. 1, the pixel array unit 12 is a horizontally-longrectangular area having a long side disposed in the horizontal directionand a short side disposed in the vertical direction.

The global control circuit 13 is a control circuit that outputs globalcontrol signals used for controlling a plurality of sensor elementsarranged in the pixel array unit 12 to be driven together(simultaneously) at approximately the same timing. In the configurationexample illustrated in FIG. 1, the global control circuit 13 is arrangedon the upper side of the pixel array unit 12 such that the longitudinaldirection thereof is along the long side of the pixel array unit 12.Thus, in the sensor chip 11, control lines 21 supplying global controlsignals output from the global control circuit 13 to the sensor elementsof the pixel array unit 12 are arranged in the vertical direction of thepixel array unit 12 for each column of sensor elements arranged in thepixel array unit 12 in a matrix pattern.

The rolling control circuit 14 is a control circuit that outputs rollingcontrol signals used for performing control such that a plurality ofsensor elements arranged in the pixel array unit 12 are sequentially(successively) driven for each row. In the configuration exampleillustrated in FIG. 1, the rolling control circuit 14 is arranged on theright side of the pixel array unit 12 such that the longitudinaldirection thereof is along the short side of the pixel array unit 12.

The column ADC 15 performs analog-to-digital (AD) conversion of analogsensor signals output from the sensor elements of the pixel array unit12 into digital values in parallel for each column. At this time, thecolumn ADC 15, for example, can remove reset noises included in thesensor signals by performing a correlated double sampling (CDS) processfor the sensor signals.

In the input/output unit 16, terminals used for performing input/outputbetween the sensor chip 11 and an external circuit are disposed, and,for example, power that is necessary for driving the global controlcircuit 13 is input to the sensor chip 11 through the input/output unit16. In the configuration example illustrated in FIG. 1, the input/outputunit 16 is arranged along the global control circuit 13 to be adjacentto the global control circuit 13. For example, the global controlcircuit 13 has high power consumption, and thus, in order to decreasethe influence of an IR drop (voltage drop), it is preferable to arrangethe input/output unit 16 near the global control circuit 13.

The sensor chip 11 is configured as such, and a layout in which theglobal control circuit 13 is arranged to be along the long side of thepixel array unit 12 is employed. Accordingly, in the sensor chip 11, adistance from the global control circuit 13 to sensor elements arrangedat a far end (the lower end in the example illustrated in FIG. 1) of thecontrol line 21 can be configured to be shorter than the layout in whichthe global control circuit 13 is arranged to be along the short side ofthe pixel array unit 12.

Accordingly, the sensor chip 11 can improve the amount of delayoccurring in a global control signal output from the global controlcircuit 13 and a slew rate, and accordingly, the sensor elements can becontrolled at a higher speed. Particularly, in a case where the sensorchip 11 is an image sensor driving a global shutter, a transmissionsignal, a reset signal, an overflow gate signal, and the like suppliedto pixels can be controlled at a high speed. On the other hand, in acase where the sensor chip 11 is a ToF sensor, a MIX signal can becontrolled at a higher speed.

For example, in a ToF sensor, a fluorescence emission detection sensor,or the like, in a case where a slew rate of a global control signal, theamount of delay of a global control signal occurring according to adistance from a driving element, or the like is different for eachsensor element, there is a detection error. In contrast to this, sincethe sensor chip 11 can improve the amount of delay occurring in theglobal control signal and the slew rate, such a detection error can besuppressed.

In addition, in a case where the sensor chip 11 is the ToF sensor, thefluorescence emission detection sensor, or the like, a plurality oftimes of On/Off control exceeding 100 times is necessary in an exposureperiod, and a consumed current becomes large due to a high togglefrequency. In contrast to this, in the sensor chip 11, as describedabove, the input/output unit 16 is arranged near the global controlcircuit 13, and a power source can be configured as an independentwiring.

In addition, in the sensor chip 11, in an exposure period, while theglobal control circuit. 13 frequently operates, the rolling controlcircuit 14 is stopped. On the other hand, in the sensor chip 11, in areading period, while the rolling control circuit 14 operates, theglobal control circuit 13 frequently stops. For this reason, in thesensor chip 11, it is requested to independently control the globalcontrol circuit 13 and the rolling control circuit 14. In addition, forthe sensor chip 11, in order to secure in-plane simultaneity, generally,a clock tree structure as illustrated in FIG. 2C to be described lateris employed in the global control circuit 13, and thus, it is preferablethat the global control circuit 13 is arranged independently from therolling control circuit 14.

Accordingly, as in the case of the sensor chip 11, in a case where it isrequested to perform control at a higher speed, by employing a layout inwhich the global control circuit 13 and the rolling control circuit 14are individually arranged independently, a more improved control processcan be performed. In addition, as long as the global control circuit 13and the rolling control circuit 14 are individually arrangedindependently, any one of a layout in which the circuits are arrangedalong a same direction and a layout in which the circuits are arrangedto be orthogonal to each other may be employed.

Note that, in this embodiment, while the upper side in the drawing willbe described as the upper side of the pixel array unit 12, and the lowerside in the drawing will be described as the lower side of the pixelarray unit 12 in accordance with the configuration example illustratedin the drawing, for example, as long as the global control circuit 13 isarranged along the long side of the pixel array unit 12, even in a casewhere the global control circuit 13 is arranged on any one of the upperside and the lower side of the pixel array unit 12, similar operationsand effects can be acquired. In addition, this similarly applies also tothe pixel array unit 12 and the column ADC 15.

The configuration of the global control circuit 13 will be describedwith reference to FIGS. 2A to 2C.

FIG. 2A illustrates a first configuration example of the global controlcircuit 13, FIG. 2B illustrates a second configuration example of theglobal control circuit 13, and FIG. 2C illustrates a third configurationexample of the global control circuit 13. Note that, while the globalcontrol circuit 13 is configured to simultaneously output global controlsignals corresponding to the number of columns of sensor elementsarranged in the pixel array unit 12, a configuration for simultaneouslyoutputting eight global control signals is schematically illustrated inFIGS. 2A to 2C as a part thereof.

A global control circuit 13 illustrated in FIG. 2A is configured toinclude one internal buffer 31 and eight driving elements 32 a to 32 h.

As illustrated in the drawing, the global control circuit 13 has aconnection configuration in which the internal buffer 31 is connected toone end of an internal wiring disposed along the longitudinal direction,and the driving elements 32 a to 32 h are connected to the internalwiring in one direction in accordance with the positions of controllines 21 illustrated in FIG. 1. Accordingly, a global control signalinput to the global control circuit 13 is supplied from one end side(the left side in the example illustrated in. FIGS. 2A to 2C) of theinternal wiring to the driving elements 32 a to 32 h through theinternal buffer 31 and is simultaneously output to the control lines 21respectively connected thereto.

A global control circuit 13A illustrated in FIG. 2B is configured toinclude two internal buffers 31 a and 31 b and eight driving elements 32a to 32 h.

As illustrated in the drawing, the global control circuit 13A has aconnection configuration in which the internal buffers 31 a and 31 b areconnected to both ends of an internal wiring disposed along thelongitudinal direction of the global control circuit 13A, and thedriving elements 32 a to 32 h are connected to the internal wiring inone direction in accordance with the positions of the control lines 21illustrated in FIG. 1. Thus, a global control signal input to the globalcontrol circuit 13A is supplied to the driving elements 32 a to 32 hfrom both the ends of the internal wirings through the internal buffers31 a and 31 b, and the supplied global control signals aresimultaneously output to the control lines 21 connected thereto.

A global control circuit 13B illustrated in FIG. 2C is configured toinclude seven internal buffers 31 a to 31 g and eight driving elements32 a to 32 h.

As illustrated in the drawing, the global control circuit 13B has aconnection configuration in which a clock tree structure is configuredby the internal buffers 31 a to 31 g and is connected to the drivingelements 32 a to 32 h arranged in one direction in accordance with thepositions of control lines 21 in the final stage. For example, the clocktree structure is a structure in which a configuration in which theoutput of one internal buffer 31 is input to two internal buffers 31 inthe first stage, and the outputs of the two internal buffers 31 areinput to four internal buffers 31 in the second stage is repeated in aplurality of stages. Thus, a global control signal input to the globalcontrol circuit 13B is supplied to the driving elements 32 a to 32 hthrough the clock tree structure formed by the internal buffers 31 a to31 g, and the supplied global control signals are simultaneously outputto control lines 21 connected thereto.

According to the global control circuit 13B having such a configuration,the occurrence of delays among the driving elements 32 a to 32 h can beavoided, and, for example, compared to the global control circuits 13and 13A, in-plane uniformity can be secured. In other words, it isappropriate to employ the global control circuit 13B for a use stronglyrequesting simultaneity over a direction in which the driving elements32 are aligned.

The configuration of the rolling control circuit 14 will be describedwith reference to FIGS. 3A and 3B.

FIG. 3A illustrates a first configuration example of the rolling controlcircuit 14, and FIG. 3B illustrates a second configuration example ofthe rolling control circuit 14. Note that, while the rolling controlcircuit 14 is configured to sequentially output rolling control signalscorresponding to the number of rows of sensor elements arranged in thepixel array unit 12, a configuration in which eight rolling controlsignals are sequentially output is schematically illustrated as a partthereof in FIGS. 3A and 3B.

The rolling control circuit 14 illustrated in FIG. 3A employs a shiftregister system and is configured to include two internal buffers 41 and42, eight registers 43 a to 43 h, and eight driving elements 44 a to 44h. Note that, for the simplification, while a configuration example inwhich the two internal buffers 41 and 42 are arranged is illustrated, aconfiguration in which a plurality of internal buffers are arrangedaccording to the wiring lengths of the internal buffers and the like maybe employed.

As illustrated in the drawing, the rolling control circuit 14 has aconnection configuration in which the internal buffer 41 is connected toone end of an internal wiring disposed along the longitudinal direction,and the registers 43 a to 43 h are connected to the internal wiring inaccordance with the positions of rows of sensor elements arranged in thepixel array unit 12. In addition, the rolling control circuit 14 has aconnection configuration in which the internal buffer 42 is connected tothe register 43 a, the registers 43 a to 43 h are sequentially connectedtogether, and the driving elements 44 a to 44 h are respectivelyconnected to the registers 43 a to 43 h.

Accordingly, in the rolling control circuit 14, a start pulse suppliedto the register 43 a through the internal buffer 42 is sequentiallyshifted to the registers 43 a to 43 h in accordance with a clock signalsupplied through the internal buffer 41, and the start pulses aresequentially output from the driving elements 44 a to 44 h respectivelyconnected to the registers 43 a to 43 h as rolling control signals.

The rolling control circuit 14A illustrated in FIG. 3B employs a decodersystem and is configured to include two internal buffers 41 and 42, adecoder 45, eight AND gates 46 a to 46 h, and eight driving elements 44a to 44 h. Note that the decoder 45 may use any one of a systemincluding a latch and a system not including a latch. For example, thedecoder 45 may employ a system in which an address is transmitted atonce, a system in which an address is divided and transmitted, or thelike as a system for latching a signal.

As illustrated in the drawing, in the rolling control circuit 14A, theinternal buffer 41 is connected to the decoder 45, the internal buffer42 is connected to input terminals of the AND gates 46 a to 46 h, andthe decoder 45 is connected to the input terminals of the AND gates 46 ato 46 h for each row. Furthermore, the rolling control circuit 14A has aconnection configuration in which output terminals of the AND gates 46 ato 46 h are connected to the driving elements 44 a to 44 h.

Accordingly, in the rolling control circuit 14A, pulses supplied to theAND gates 46 a to 46 h through the internal buffer 42 are sequentiallyoutput from the driving elements 44 a to 44 h of a row designatedaccording to an address supplied to the decoder 45 through the internalbuffer 41 as rolling control signals.

As described with reference to FIGS. 2A to 3B, the global controlcircuit 13 and the rolling control circuit 14 have mutually-differentcircuit configurations.

FIG. 4 is a block diagram that illustrates a first modified example ofthe sensor chip 11 illustrated in FIG. 1. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip 11illustrated in FIG. 1 among blocks configuring a sensor chip 11-aillustrated in FIG. 4, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 4, in the sensor chip 11-a, thearrangement of a pixel array unit 12, a rolling control circuit 14, acolumn ADC 15, and an input/output unit 16 is common to the sensor chip11 illustrated in FIG. 1.

On the other hand, in the sensor chip 11-a, two global control circuits13-1 and 13-2 are arranged along the upper side and the lower side ofthe pixel array unit 12, and driving elements 32-1 and 32-2 areconnected to both ends of a control line 21, which is different from theconfiguration of the sensor chip 11 illustrated in FIG. 1.

In other words, the sensor chip 11-a is configured such that the drivingelement 32-1 included in the global control circuit 13-1 supplies aglobal control signal from the upper end of the control line 21, and thedriving element 32-2 included in the global control circuit 13-2supplies a global control signal from the lower end of the control line21.

The sensor chip 11-a configured in this way can suppress a skew betweenthe two driving element 32-1 and the driving element 32-2, andaccordingly, variations in delay times occurring in global controlsignals propagating through the control line 21 can be eliminated.

Accordingly, the sensor chip 11-a can perform control for sensorelements at a higher speed. In addition, it is necessary for the sensorchip 11-a to perform control such that an increase in the delaydifference between outputs of global control signals is avoided toprevent the generation of a through current.

FIG. 5 is a block diagram that illustrates a second modified example ofthe sensor chip 11 illustrated in FIG. 1. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip 11illustrated in FIG. 1 among blocks configuring a sensor chip 11-billustrated in FIG. 5, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 5, in the sensor chip 11-b, thearrangement of a pixel array unit 12, a rolling control circuit 14, acolumn ADC 15, and an input/output unit 16 is common to the sensor chip11 illustrated in FIG. 1.

On the other hand, in the sensor chip 11-b, two global control circuits13-1 and 13-2 are arranged along the upper side and the lower side ofthe pixel array unit 12, and two control lines 21-1 and 21-2 arearranged to be separate at the center of the column of sensor elementsarranged in a matrix pattern in the pixel array unit 12, which isdifferent from the configuration of the sensor chip 11 illustrated inFIG. 1. Furthermore, in the sensor chip 11-b, a driving element 32-1 isconnected to the upper end of the control line 21-1, and a drivingelement 32-2 is connected to the lower end of the control line 21-2.

Accordingly, the sensor chip 11-b is configured such that the drivingelement 32-1 included in the global control circuit 13-1 supplies aglobal control signal from the upper end of the control line 21-1 tosensor elements arranged on the upper side from the center of the pixelarray unit 12. In addition, the sensor chip 11-b is configured such thatthe driving element 32-2 included in the global control circuit 13-2supplies a global control signal from the lower end of the control line21-2 to a sensor element arranged on a further lower side than thecenter of the pixel array unit 12.

In the sensor chip 11-b configured in this way, a distance from thedriving element 32-1 to a sensor element arranged at a far end (thelower end in the example illustrated in FIG. 5) of the control line 21-1and a distance from the driving element 32-2 to a sensor elementarranged at a far end (the upper end in the example illustrated in FIG.5) of the control line 21-2 can be configured to be shorter than thoseof the sensor chip 11 illustrated in FIG. 1. In this way, the sensorchip 11-b can further decrease the amount of delay occurring in globalcontrol signals output from the global control circuits 13-1 and 13-2and the slew rate thereof, and accordingly, the control for sensorelements can be performed at a higher speed.

<Second Configuration Example of Sensor Chip>

A sensor chip according to a second embodiment of the present technologywill be described with reference to FIG. 6. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip 11illustrated in FIG. 1 among blocks configuring a sensor chip 11Aillustrated in FIG. 6, and detailed description thereof will not bepresented.

As illustrated in FIG. 6, the sensor chip 11A has a configuration inwhich a pixel array unit 12A, a global control circuit 13A, a rollingcontrol circuit 14A, a column ADC 15A, and an input/output unit 16A arearranged on a semiconductor substrate.

Furthermore, in the sensor chip 11A, the pixel array unit 12A is avertically-long rectangular area in which a long side is disposed in thevertical direction, and a short side is disposed in the horizontaldirection, which is different from the configuration of the sensor chip11 illustrated in FIG. 1. Thus, in the sensor chip 11A, the globalcontrol circuit 13A and the input/output unit 16A are arranged on theleft side of the pixel array unit 12A along the long side of the pixelarray unit 12A. In accompaniment with this, a control line 21A isarranged in the horizontal direction of the pixel array unit 12A foreach row of sensor elements arranged in the pixel array unit 12A in amatrix pattern.

In addition, in the sensor chip 11A, the rolling control circuit 14A isarranged on the right side (a side facing the global control circuit13A) of the pixel array unit 12A along the long side of the pixel arrayunit 12A.

Note that, although the global control circuit 13A and the pixel arrayunit 12A may be arranged on the same side with respect to the pixelarray unit 12A, in such a case, the wiring length of one side is assumedto be increased, and thus, the arrangement as illustrated in the drawingis preferable.

In addition, in the sensor chip 11A, the column ADC 15A is arranged onthe lower side of the pixel array unit 12A along the snort side of thepixel array unit 12A. In this way, the reason for arranging the columnADC 15A in a direction orthogonal to the rolling control circuit 14A isfor a need for the column ADC 15A to turn on one sensor elementconnected to one AD converter each time, and a layout in which wiringsoverlap each other is avoided.

In the sensor chip 11A configured in this way, similar to the sensorchip 11 illustrated in FIG. 1, by employing a layout in which the globalcontrol circuit 13A is arranged along the long side of the pixel arrayunit 12A, the wiring length of the control line 21A can be configured tobe short. Accordingly, the sensor chip 11A, similar to the sensor chip11 illustrated in FIG. 1, can perform control for sensor elements at ahigher speed.

<Third Configuration Example of Sensor Chip>

A sensor chip according to a third embodiment of the present technologywill be described with reference to FIGS. 7 to 10. Note that a samereference numeral will be assigned to a configuration common to thesensor chip 11 illustrated in FIG. 1 among blocks configuring the sensorchip 11B illustrated in FIGS. 7 to 10, and detailed description thereofwill not be presented.

FIG. 7 illustrates a perspective view of the sensor chip 11B, and FIG. 8illustrates a block diagram of the sensor chip 11B.

As illustrated in FIG. 7, the sensor chip 11B has a stacking structurein which a sensor substrate 51 in which a pixel array unit 12 is formedand a logic substrate 52 in which a global control circuit 13 is formedare stacked. Furthermore, the sensor chip 11B has a connectionconfiguration in which a control line 21 of the sensor substrate 51 andthe global control circuit 13 of the logic substrate 52 are connected ina peripheral area of the sensor chip 11B not overlapping the pixel arrayunit 12 in the plan view. In other words, in the example illustrated inFIG. 7, in the sensor chip 11B, a plurality of control lines 21 arrangedalong the column direction of sensor elements arranged in the pixelarray unit 12 in a matrix pattern are connected to the global controlcircuit 13 side on the upper side of the sensor substrate 51.

Thus, in the sensor chip 11B, a global control signal output from theglobal control circuit 13, as denoted by a white arrow in FIG. 7, issupplied from the upper side of the sensor substrate 51 to sensorelements of the pixel array unit 12. At this time, the longitudinaldirection of the global control circuit 13 is arranged along the longside of the pixel array unit 12, and the sensor chip 11B has aconfiguration having a shortest distance from the global control circuit13 to the sensor elements of the pixel array unit 12.

The configuration of the sensor chip 11B will be further described withreference to FIG. 8.

In the sensor substrate 51, the pixel array unit 12 and through siliconvia (TSV) areas 53-1 to 53-3 are arranged.

In the logic substrate 52, the global control circuit 13, a rollingcontrol circuit 14, a column ADC 15, a logic circuit 17, and TSV areas54-1 to 54-3 are arranged. For example, in the sensor chip 11B, a sensorsignal output from a sensor element of the pixel array unit 12 isconverted from analog to digital by the column ADC 15, and various kindsof signal processing is performed for the digital sensor signal by thelogic circuit 17, and then, a resultant signal is output to the outside.

The TSV areas 53-1 to 53-3 and the TSV areas 54-1 to 54-3 are areas inwhich through electrodes used for electrically connecting the sensorsubstrate 51 and the logic substrate 52 are formed, and, for example, athrough electrode is arranged for each control line 21.

Accordingly, the TSV areas 53-1 to 53-3 and the TSV areas 54-1 to 54-3are arranged to overlap each other when the sensor substrate 51 and thelogic substrate 52 are stacked. Note that, instead of connections usingthe through electrodes in the TSV areas 54, for example, micro bumps,copper (Cu—Cu) connections, or the like can be used.

The sensor chip 11B configured in this way, similar to the sensor chip11 illustrated in FIG. 1, by employing a layout in which the globalcontrol circuit 13 is arranged along the long side of the pixel arrayunit 12, can configure the wiring length of the control line 21 to beshort. Accordingly, the sensor chip 11B, similar to the sensor chip 11illustrated in FIG. 1, can perform control for the sensor elements at ahigher speed.

FIG. 9 is a block diagram that illustrates a first modified example ofthe sensor chip 11B illustrated in FIG. 8. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11B illustrated in FIG. 8 among blocks configuring a sensor chip 11B-aillustrated in FIG. 9, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 9, the sensor chip 11B-a has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11B illustrated in FIG. 8.

On the other hand, in the sensor chip 11B-a, two global control circuits13-1 and 13-2 are arranged in the logic substrate 52 along the upperside and the lower side of the pixel array unit 12, and two controllines 21-1 and 21-2 are arranged to be separate at the center of thecolumn of the sensor elements arranged in the pixel array unit 12 in amatrix pattern, which is different from the configuration of the sensorchip 11B illustrated in FIG. 8.

In other words, in the sensor chip 11B-a, similar to the sensor chip11-b illustrated in FIG. 5, the driving element 32-1 is connected to theupper end of the control line 21-1, and the driving element 32-2 isconnected to the lower end of the control line 21-2. Accordingly, in thesensor chip 11B-a, the driving element 32-1 included in the globalcontrol circuit 13-1 is configured to supply a global control signalfrom the upper end of the control line 21-1 to the sensor elementarranged on a further upper side than the center of the pixel array unit12. In addition, in the sensor chip 11B-a, the driving element 32-2included in the global control circuit 13-2 is configured to supply aglobal control signal from the lower end of the control line 21-2 to asensor element arranged on a further lower side than the center of thepixel array unit 12.

In the sensor chip 11B-a configured in this way, a distance from thedriving element 32-1 to a sensor element arranged at a far end (thelower end in the example illustrated in FIG. 9) of the control line 21-1and a distance from the driving element 32-2 to a sensor elementarranged at a far end (the upper end in the example illustrated in FIG.9) of the control line 21-2 can be configured to be shorter than thoseof the sensor chip 11B illustrated in FIG. 8. In this way, the sensorchip 11B-a can further decrease the amount of delay occurring in globalcontrol signals output from the global control circuits 13-1 and 13-2and the slew rate thereof, and accordingly, the control for sensorelements can be performed at a higher speed.

FIG. 10 is a block diagram that illustrates a second modified example ofthe sensor chip 11B illustrated in FIG. 8. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11B illustrated in FIG. 8 among blocks configuring a sensor chip 11B-billustrated in FIG. 10, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 10, the sensor chip 11B-b has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11B illustrated in FIG. 8.

On the other hand, in the sensor chip 11B-b, two global control circuits13-1 and 13-2 are arranged in the logic substrate 52 along the upperside and the lower side of the pixel array unit 12, respectively, andthe driving elements 32-1 and 32-2 are connected to both ends of thecontrol line 21, which is different from the configuration of the sensorchip 11B illustrated in FIG. 8.

In other words, in the sensor chip 11B-b, similar to the sensor chip11-a illustrated in FIG. 4, the driving element 32-1 included in theglobal control circuit 13-1 is configured to supply a global controlsignal from the upper end of the control line 21, and the drivingelement 32-2 included in the global control circuit 13-2 is configuredto supply a global control signal from the lower end of the control line21.

In the sensor chip 11B-b configured in this way, a skew between the twodriving elements 32-1 and 32-2 can be suppressed, and variations indelay times occurring in global control signals propagating through thecontrol line 21 can be eliminated. Accordingly, the sensor chip 11B-bcan perform control for the sensor elements at a higher speed. Inaddition, in the sensor chap 11B-b, it is necessary to perform controlto avoid an increase in the delay difference among the outputs of globalcontrol signals so as to prevent the generation of a through current.

In the sensor chip 11B configured as above, in the stacking structure inwhich the sensor substrate 51 and the logic substrate 52 are stacked,similar to the sensor chip 11 illustrated in FIG. 1, control for thesensor elements can be performed at a higher speed.

Note that, in the configuration example illustrated in FIGS. 8 to 10,the column ADC 15 is configured to read sensor signals from the lowerend side of the pixel array unit 12 through the TSV area 53-3 and theTSV area 54-3 arranged on the lower side. Other than such aconfiguration, for example, a configuration in which two column ADCs 15are arranged near the upper side and the lower side, and sensor signalsare read from the upper end side and the lower end side of the pixelarray unit 12 may be employed.

<Fourth Configuration Example of Sensor Chip>

A sensor chip according to a fourth embodiment of the present technologywill be described with reference to FIG. 11. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11B illustrated in FIG. 8 among blocks configuring the sensor chip 11Cillustrated in FIG. 11, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 11, in the sensor chip 11C, byemploying a stacking structure in which a sensor substrate 51 in which apixel array unit 12 is formed and a logic substrate 52 in which a globalcontrol circuit 13 is formed are stacked, a configuration common to thesensor chip 11B illustrated in FIG. 8 is formed.

On the other hand, in the sensor chip 11C, similar to the pixel arrayunit 12A of the sensor chap 11A illustrated in FIG. 6, a pixel arrayunit 12C is a vertically-long rectangular area, which is different fromthe configuration of the sensor chip 11B illustrated in FIG. 8.Accordingly, in the sensor chip 11C, a global control circuit 13C isarranged on the left side of the logic substrate 52 along the long sideof the pixel array unit 12C. In accompaniment with this, a control line21C is arranged in a horizontal direction of the pixel array unit 12Cfor each row of sensor elements arranged in the pixel array unit 12C ina matrix pattern.

In addition, in the sensor chip 11C, a rolling control circuit 14C isarranged on the right side (a side facing the global control circuit13C) of a logic substrate 52 along the long side of the pixel array unit12C. Note that, although the global control circuit 13C and the pixelarray unit 12C may be arranged on the same side of the logic substrate52, in such a case, the wiring length of one side is assumed to beincreased, and thus, the arrangement as illustrated in the drawing ispreferable.

In addition, in the sensor chip 11C, a column. ADC 15C is arranged onthe lower side of the logic substrate 52 along the short side of thepixel array unit 12C. In this way, the reason for arranging the columnADC 15C in a direction orthogonal to the rolling control circuit 14C isfor a need for the column ADC 15C to turn on one sensor elementconnected to one AD converter each time, and a layout in which wiringsoverlap each other is avoided.

In the sensor chip 11C configured in this way, similar to the sensorchip 11B illustrated in FIG. 8, by employing a layout in which theglobal control circuit 13C is arranged along the long side of the pixelarray unit 12C, the wiring length of the control line 21C can beconfigured to be short. Accordingly, the sensor chip 11C, similar to thesensor chip 11B illustrated in FIG. 8, can perform control for sensorelements at a higher speed.

<Fifth Configuration Example of Sensor Chip>

A sensor chip according to a fifth embodiment of the present technologywill be described with reference to FIG. 12. Note that, a same referencenumeral will be assigned to a configuration common to the sensor chip11B illustrated in FIG. 8 among blocks configuring the sensor chip 11Dillustrated in FIG. 12, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 12, in the sensor chip 11D, byemploying a stacking structure in which a sensor substrate 51 in which apixel array unit 12 is formed and a logic substrate 52 which a globalcontrol circuit 13 is formed are stacked, a configuration common to thesensor chip 11B illustrated in FIG. 8 is formed.

On the other hand, in the sensor chip 11D, in the logic substrate 52, aplurality of ADCs 15, in the example illustrated in FIG. 12, 12 ADCs15-1 to 15-12 are arranged in correspondence with an area of the sensorsubstrate 51 in which the pixel array unit 12 is formed, which isdifferent from the configuration of the sensor chip 11B illustrated inFIG. 8.

For example, the sensor chip 11D has a configuration in which an ADC 15is arranged for each predetermined area of the pixel array unit 12. Asillustrated in the drawing, in a case where 12 ADCs 15-1 to 15-12 areused, the ADC 15 is arranged for each area acquired by dividing thepixel array unit 12 into 12 equal parts, and AD conversions of sensorsignals output from sensor elements disposed in the areas are performedin parallel. Note that other than the configuration in which the ADC 15is arranged for each predetermined area of the pixel array unit 12, forexample, a configuration in which one ADC 15 is arranged for each onesensor element included in the pixel array unit 12 may be employed.

In the sensor chip 11D configured in this way, similar to the sensorchip 11B illustrated in FIG. 8, by employing a layout in which theglobal control circuit 13 is arranged along the long side of the pixelarray unit 12, the wiring length of the control line 21 can beconfigured to be short. Accordingly, the sensor chip 11D, similar to thesensor chip 11B illustrated in FIG. 8, can perform control for sensorelements at a higher speed.

In addition, in the sensor chip 11D, a positional relation between therolling control circuit 14 and the ADC 15 is not limited to that of thecolumn ADC 15 illustrated in FIG. 8. For example, in the sensor chip 11Dillustrated in FIG. 12, although the rolling control circuit 14 isarranged on the right side of the logic substrate 52, the rollingcontrol circuit 14 may be arranged on any one of the upper side and thelower side.

In other words, when there is no limit on the arrangement position (forexample, a center position of the sensor chip 11D with respect to theoptical center) of the pixel array unit 12 with respect to the sensorchip 11D or the like, the roll control circuit 14 may be arranged at anyposition.

Alternatively, for example, in a case where there is a strong limitbetween the optical center and the center position of the sensor chip11D, by arranging the rolling control circuit 14 at a position disposedon a side opposite to an area in which the ADC 15 is arranged withrespect to the global control circuit 13, the balance of the layout canbe improved. Accordingly, the characteristic of the sensor chip 11D canbe improved.

<Sixth Configuration Example of Sensor Chip>

A sensor chip according to a sixth embodiment of the present technologywill be described with reference to FIGS. 13 to 22. Note that a samereference numeral will be assigned to a configuration common to thesensor chip 11B illustrated in FIGS. 7 and 8 among blocks configuringthe sensor chip 11E illustrated in FIGS. 13 to 22, and detaileddescription thereof will not be presented.

As illustrated in FIG. 13, the sensor chip 11E, similar to the sensorchip 11B illustrated in FIG. 7, employs a stacking structure in which asensor substrate 51 in which a pixel array unit 12 is formed and a logicsubstrate 52 in which a global control circuit 13 is formed are stacked.Furthermore, the sensor chip 11E has a connection configuration in whichthe global control circuit 13 is arranged to overlap the center of thepixel array unit 12 in the plan view, and the global control circuit 13is connected to a control line 21 at the center portion of the pixelarray unit 12.

For example, in a case where a connection can be made in the pixel arrayunit 12 by using a connection between copper (Cu) and copper configuringwirings, a connection using micro bumps or TSVs, or the like, the sensorchip 11E can configure a distance from a driving element 32 to a sensorelement arranged at a far end of the control line 21 to be short.

The configuration of the sensor chip 11E will be further described withreference to FIG. 14.

As illustrated in FIG. 14, in the sensor substrate 51, the pixel arrayunit 12 is a horizontally-long rectangular area in which a long side isdisposed in the horizontal direction, and a short side is disposed inthe vertical direction. Accordingly, in the logic substrate 52, theglobal control circuit 13 is arranged such that the longitudinaldirection is along the long side of the pixel array unit 12. Then, theglobal control circuit 13 is arranged at approximate center of the logicsubstrate 52 such that a wiring output from a driving element 32 of theglobal control circuit 13 is connected to the center of a control line21 arranged in the vertical direction of the pixel array unit 12. Inaddition, in the plan view, a configuration may be employed in which awiring output from a driving element 32 from the global control circuit13 directly toward the pixel array unit 12 passes through the substrate.

In the sensor chip 11E configured in this way, a distance from thedriving element 32 to sensor elements arranged at both ends of thecontrol line 21 can be configured to be short. Thus, since the amount ofdelay and the slew rate of the global control signal can be improved,the sensor chip 11E can perform control for the sensor elements at ahigher speed.

In addition, the configuration as represented in the sensor chip 11E,for example, is appropriate for an application for a ToF sensor.

FIG. 15 is a block diagram that illustrates a first modified example ofthe sensor chip 11E illustrated in FIG. 14. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11E illustrated in FIG. 14 among blocks configuring a sensor chip 11E-aillustrated in FIG. 15, and detailed description thereof will not bepresented.

In other words, as illustrated in FIG. 15, the sensor chip 11E-a has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11E illustrated in FIG. 14.

On the other hand, in the sensor chip 11E-a, in the sensor substrate 51,two control lines 21-1 and 21-2 divided from the center are arranged inone row of sensor elements arranged in the pixel array unit 12 in amatrix pattern, which is different from the configuration of the sensorchip 11E illustrated in FIG. 14. In addition, in the sensor chip 11E-a,in the logic substrate 52, the global control circuit 13 includes twodriving elements 32-1 and 32-2 for one row of the sensor elements, whichis different from the configuration of the sensor chip 11E illustratedin FIG. 14.

Furthermore, the sensor chip 11E-a has a connection configuration inwhich the driving element 32-1 is connected to a center-side end portionof the control line 21-1, and the driving element 32-2 is connected to acenter-side end portion of the control line 21-2. In other words, in thesensor chip 11E-a, among a plurality of sensor elements arranged in onerow of the pixel array unit 12, sensor elements arranged on a furtherupper side than the center are driven by the driving element 32-1through the control line 21-1, and sensor elements arranged on a furtherlower side than the center are configured to be driven by the drivingelement 32-2 through the control line 21-2.

The sensor chip 11E-a configured in this way, similar to the sensor chip11E illustrated in FIG. 14, can configure a distance from the drivingelement 32-1 to a sensor element arranged at a far end of the controlline 21-1 and a distance from the driving element 32-2 to a sensorelement arranged at a far end of the control line 21-2 to be short.Accordingly, the sensor chip 11E-a, similar to the sensor chip 11Eillustrated in FIG. 14 can improve the amount of delay and the slew rateof the global control signal.

In addition, in the sensor chip 11E-a, since the load per one drivingelement 32 can be decreased, the size of the driving element 32 can bedecreased to be less than that of the sensor chip 11E illustrated inFIG. 14. In addition, in the sensor chip 11E-a, by employing aconfiguration in which two driving elements 32 are arranged for onecolumn of sensor elements, the layout of the driving elements 32 isintegrated at one place, and accordingly, the whole layout structure canbe simplified.

FIG. 16 is a block diagram that illustrates a second modified example ofthe sensor chip 11E illustrated in FIG. 14. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11E illustrated in FIG. 14 among blocks configuring a sensor chip 11E-billustrated in FIG. 16, and detailed description thereof will not bepresented.

In other words, the sensor chip 11E-b illustrated in FIG. 16 has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11E illustrated in FIG. 14.

On the other hand, in the sensor chip 11E-b, in the sensor substrate 51,two control lines 21-1 and 21-2 divided from the center are arranged inone row of sensor elements arranged in the pixel array unit 12 in amatrix pattern, which is different from the configuration of the sensorchip 11E illustrated in FIG. 14. In addition, in the sensor chip 11E-b,in the logic substrate 52, two global control circuits 13-1 and 13-2 arearranged, which is different from the configuration of the sensor chip11E illustrated in FIG. 14.

Furthermore, the sensor chip 11E-b has a connection configuration inwhich the driving element 32-1 is connected to the center of the controlline 21-1, and the driving element 32-2 is connected to the center ofthe control line 21-2. In other words, in the sensor chip 11E-b, among aplurality of sensor elements arranged in one row of the pixel array unit12, sensor elements arranged on a further upper side than the center aredriven by the driving element 32-1 through the control line 21-1, andsensor elements arranged on a further lower side than the center areconfigured to be driven by the driving element 32-2 through the controlline 21-2.

The sensor chip 11E-b configured in this way can configure a distancefrom the driving element 32-1 to a sensor element arranged at a far endof the control line 21-1 and a distance from the driving element 32-2 toa sensor element arranged at a far end of the control line 21-2 to beshorter than those of the sensor chip 11E illustrated in FIG. 14.Accordingly, the sensor chip 11E-b can be driven at a higher speed thanthat of the sensor chip 11E illustrated in FIG. 14 and can furtherimprove the amount of delay and the slew rate of the global controlsignal.

In addition, as illustrated in FIG. 16, in the sensor chip 11E-b, theglobal control circuits 13-1 and 13-2 can be arranged in a divisionalmanner, and accordingly, the logic circuit 17 can be arranged at acenter position therebetween. Note that, while not illustrated in thedrawing, a column ADC 15 may be arranged at a center position betweenthe global control circuits 13-1 and 13-2.

In addition, the configuration represented in the sensor chip 11E-b, forexample, is appropriate for an application to a ToF.

FIG. 17 is a block diagram that illustrates a third modified example ofthe sensor chip 11E illustrated in FIG. 14. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11E illustrated in FIG. 14 among blocks configuring a sensor chip 11E-cillustrated in FIG. 17, and detailed description thereof will not bepresented.

In other words, the sensor chip 11E-c illustrated in FIG. 17 has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11E illustrated in FIG. 14.

On the other hand, in the sensor chip 11E-c, in the sensor substrate 51,two control lines 21-1 and 21-2 divided from the center are arranged inone row of sensor elements arranged in the pixel array unit 12 in amatrix pattern, which is different from the configuration of the sensorchip 11E illustrated in FIG. 14. In addition, in the sensor chip 11E-c,in the logic substrate 52, two global control circuits 13-1 and 13-2 arearranged, which different from the configuration of the sensor chip 11Eillustrated in FIG. 14.

Furthermore, the sensor chip 11E-c, similar to the sensor chip 11E-billustrated in FIG. 16, has a connection configuration in which thedriving element 32-1 is connected to the center of the control line21-1, and the driving element 32-2 is connected to the center of thecontrol line 21-2. Accordingly, the sensor chip 11E-c, similar to thesensor chip 11E-b illustrated in FIG. 16, can be driven at a higherspeed than that of the sensor chip 11E illustrated in FIG. 14 and canfurther improve the amount of delay and the slew rate of the globalcontrol signal.

In addition, in the sensor chip 11E-c, the column ADC 15-1 is arrangedon the upper side of the logic substrate 52, the column ADC 15-2 isarranged on the lower side of the logic substrate 52. The sensor chip11E-c configured in this way has a structure having a layout that isvertically symmetrical to have improved symmetry, and, as a result, thecharacteristics of the sensor chip 11E-c can be improved.

FIG. 18 is a block diagram that illustrates a fourth modified example ofthe sensor chip 11E illustrated in FIG. 14. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11E illustrated in FIG. 14 among blocks configuring a sensor chip 11E-dillustrated in FIG. 18, and detailed description thereof will not bepresented.

In other words, the sensor chip 11E-d illustrated in FIG. 18 has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11E illustrated in FIG. 14.

On the other hand, in the sensor chip 11E-d, in the logic substrate 52,two global control circuits 13-1 and 13-2 are arranged, and a connectionform in which the global control circuit 13-1 is connected toapproximate center of an upper half of a control line 21, and the globalcontrol circuit 13-2 is connected to approximate center of a lower halfof the control line 21 is formed is formed, which is different from theconfiguration of the sensor chip 11E illustrated in FIG. 14. In otherwords, in the sensor chip 11E-d, a configuration in which one controlline 21 acquired by connecting the control lines 21-1 and 21-2illustrated in FIG. 17 is used is formed.

The sensor chip 11E-d configured in this way can suppress a skew betweenthe two driving element 32-1 and the driving element 32-2, andaccordingly, variations between delay times occurring in global controlsignals propagating through the control line 21 can be eliminated.

Accordingly, the sensor chip 11E-d can perform control for sensorelements at a higher speed. In addition, it is necessary for the sensorchip 11E-d to perform control such that an increase in the delaydifference between outputs of global control signals is avoided toprevent the generation of a through current.

FIG. 19 is a block diagram that illustrates a fifth modified example ofthe sensor chip 11E illustrated in FIG. 14. Note that a same referencenumeral will be assigned to a configuration common to the sensor chip11E illustrated in FIG. 14 among blocks configuring a sensor chip 11E-eillustrated in FIG. 19, and detailed description thereof will not bepresented. In addition, in the sensor chip 11E-e illustrated in FIG. 19,in order to avoid complicating of the drawing, the presentation of apart of blocks configuring the sensor chip 11E-e is omitted.

In other words, the sensor chip 11E-e illustrated in FIG. 19 has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11E illustrated in FIG. 14.

On the other hand, in the sensor chip 11E-e, in the sensor substrate 51,four-divided control lines 21-1 to 21-4 are arranged in one row ofsensor elements arranged in the pixel array unit 12 in a matrix pattern,which is different from the configuration of the sensor chip 11Eillustrated in FIG. 14. In addition, in the sensor chip 11E-e, in thelogic substrate 52, four global control circuits 13-1 to 13-4 arearranged, which is different from the configuration of the sensor chip11E illustrated in FIG. 14.

Furthermore, the sensor chip 11E-e has a connection configuration inwhich driving elements 32-1 to 32-4 of the global control circuits 13-1to 13-4 are respectively connected to the centers of the control lines21-1 to 21-4. Accordingly, the sensor chip 11E-e can configure distancesfrom the driving elements 32-1 to 32-4 to sensor elements arranged atfar ends of the control lines 21-1 to 21-4 to be further short. In thisway, the sensor chip 11E-e can achieve control for the sensor elementsat a further higher speed. Note that, in the sensor chip 11E-e, whilethe column ADC 15A, the logic circuit 17, and the like are assumed to bedivided and arranged, even in such a case, it is necessary to employ alayout not having any influence on the characteristics.

Note that, in the configuration example illustrated in FIG. 19, whilethe description is presented using the four-divided control lines 21-1to 21-4, the control line 21 may be divided into three or five or morecontrol lines. Furthermore, a configuration in which a correspondingglobal control circuit 13 is connected to approximate center of each ofthe divided control lines 21 may be employed.

FIG. 20 as a block diagram that illustrates a sixth modified example ofthe sensor chip 11E illustrated in FIG. 14. Note that, a same referencenumeral will be assigned to a configuration common to the sensor chap11E illustrated in FIG. 14 among blocks configuring a sensor chip 11E-fillustrated in FIG. 20, and detailed description thereof will not bepresented.

In other words, the sensor chip 11E-f illustrated in FIG. 20 has astacking structure in which a sensor substrate 51 in which a pixel arrayunit 12 is formed and a logic substrate 52 in which a global controlcircuit 13 is formed are stacked to have a configuration common to thatof the sensor chip 11E illustrated in FIG. 14.

On the other hand, the sensor chip 11E-f has a connection configurationin which four global control circuits 13-1 to 13-4 are arranged in thelogic substrate 52, and the global control circuits 13-1 to 13-4 areconnected to a control line 21 at equal gaps, which is different fromthe configuration of the sensor chip 11E illustrated in FIG. 14. Inother words, the sensor chip 11E-d has a configuration in which onecontrol line 21 to which the control lines 21-1 to 21-4 illustrated inFIG. 19 are connected is used.

The sensor chip 11E-f configured in this way can suppress skews amongthe four driving elements 32-1 to 32-4, and, variations among delaytimes occurring in global control signals propagating through thecontrol line 21 can be eliminated. Accordingly, the sensor chip 11E-fcan perform control for sensor elements at a higher speed.

In addition, it is necessary for the sensor chip 11E-f to performcontrol such that an increase in the delay difference between outputs ofglobal control signals is avoided to prevent the generation of a throughcurrent.

FIG. 21 is a block diagram that illustrates a seventh modified exampleof the sensor chip 11E illustrated in FIG. 14. Note that a samereference numeral will be assigned to a configuration common to thesensor chip 11E-e illustrated in FIG. 19 among blocks configuring asensor chip 11E-g illustrated in FIG. 21, and detailed descriptionthereof will not be presented.

In other words, the sensor chip 11E-g is configured to include oneglobal control circuit 13 and is configured to include buffer circuits55-1 to 55-3 replacing the global control circuits 13-2 to 13-4 of thesensor chip 11E-e illustrated in FIG. 19. The buffer circuits 55-1 to55-3 respectively include buffers 56-1 to 56-3, and the outputs of thedriving elements 32 of the global control circuit 13 respectivelybranched in the buffers 56-1 to 56-3 and are connected to four-dividedcontrol lines 21-1 to 21-4.

Also in the sensor chip 11E-g configured in this way, similar to thesensor chip 11E-e illustrated in FIG. 19, the control of sensor elementsat a further high speed can be achieved.

FIG. 22 is a block diagram that illustrates an eighth modified exampleof the sensor chip 11E illustrated in FIG. 14. Note that a samereference numeral will be assigned to a configuration common to thesensor chip 11E-f illustrated in FIG. 20 among blocks configuring asensor chip 11E-h illustrated in FIG. 22, and detailed descriptionthereof will not be presented.

In other words, the sensor chip 11E-h is configured to include oneglobal control circuit 13 and is configured to include buffer circuits55-1 to 55-3 replacing the global control circuits 13-2 to 13-4 of thesensor chip 11E-f illustrated in FIG. 20. The buffer circuits 55-1 to55-3 respectively include buffers 56-1 to 56-3, and the outputs of thedriving elements 32 of the global control circuit 13 respectively branchto the buffers 56-1 to 56-3 and are connected to a control line 21.

Also in the sensor chip 11E-h configured in this way, similar to thesensor chip 11E-f illustrated in FIG. 20, the control of sensor elementsat a further high speed can be achieved.

<Seventh Configuration Example of Sensor Chip>

A sensor chip according to a seventh embodiment of the presenttechnology will be described with reference to FIGS. 23 to 25. Note thata same reference numeral will be assigned to a configuration common tothe sensor chip 11E illustrated in FIG. 13 among blocks configuring thesensor chip 11F illustrated in FIGS. 23 to 25, and detailed descriptionthereof will not be presented.

In other words, the sensor chip 11F illustrated in FIG. 23 has astacking structure in which a sensor substrate 51 and two logicsubstrates 52-1 and 52-2 are stacked.

In other words, the present technology can be applied to a structure inwhich three semiconductor substrates are stacked.

As illustrated in FIG. 23, the sensor chip 11F has a configuration inwhich a pixel array unit 12 is formed in a sensor substrate 51 of afirst layer, a global control circuit 13 and memories 61-1 and 61-2 areformed in a logic substrate 52-1 of a second layer, and, for example, acolumn ADC 15, a logic circuit 17, and the like not illustrated in thedrawing are formed in a logic substrate 52-2 of a third layer.

Also in the sensor chip 11F configured in this way, by arranging aglobal control circuit 13 in the logic substrate 52-1 in thelongitudinal direction of the pixel array unit 12 of the sensorsubstrate 51, similar to the sensor chip 11E illustrated in FIG. 13,control of sensor elements can be performed at a higher speed.

In addition, in the sensor chip 11F in which sensor substrate 51, thelogic substrate 52-1, and the logic substrate 52-2 are stacked in thementioned order, the global control circuit 13 is preferably arranged atthe center of the logic substrate 52-1 stacked between the sensorsubstrate 51 and the logic substrate 52-2.

Accordingly, a distance between the global control circuit 13 to asensor element arranged at a far end of a control line 21 can beconfigured to be short. It is apparent that the layout is not limited tothe layout illustrated in FIG. 23, as long as the distance from theglobal control circuit 13 to the sensor element arranged at the far endof the control line 21 can be configured to be short.

FIG. 24 is a perspective view that illustrates a first modified exampleof the sensor chip 11F illustrated in FIG. 23.

As illustrated in FIG. 24, the sensor chip 11F-a has a configuration inwhich a pixel array unit 12 is formed in a sensor substrate 51 of thefirst layer, memories 61-1 and 61-2 are formed in a logic substrate 52-1of the second layer, and for example, a global control circuit 13 and acolumn ADC 15, a logic circuit 17, and the like not illustrated in thedrawing are formed in a logic substrate 52-2 of the third layer.

Also in the sensor chip 11F-a configured in this way, by arranging theglobal control circuit 13 in the logic substrate 52-2 along thelongitudinal direction of a pixel array unit 12 of the sensor substrate51, similar to the sensor chip 11E illustrated in FIG. 13, control ofsensor elements can be performed at a higher speed.

FIG. 25 is a perspective view that illustrates a second modified exampleof the sensor chip 11F illustrated in FIG. 23.

As illustrated in FIG. 25, the sensor chip 11F-b has a configuration inwhich a pixel array unit 12 is formed in a sensor substrate 51 of thefirst layer, a memory 61 is formed in a logic substrate 52-1 of thesecond layer, and for example, a global control circuit 13 and a columnADC 15, a logic circuit 17, and the like not illustrated in the drawingare formed in a logic substrate 52-2 of the third layer. In addition,the sensor chip 11F-b, for example, similar to the sensor chip 11Billustrated in FIG. 8, has a connection configuration in which a controlline 21 is connected to the global control circuit 13 by using a TSVarea formed in a peripheral area of the sensor chip 11F-b.

Also in the sensor chip 11F-b configured in this way, by arranging aglobal control circuit 13 in the logic substrate 52-2 in thelongitudinal direction of the pixel array unit 12 of the sensorsubstrate 51, similar to the sensor chip 11E illustrated in FIG. 13,control of sensor elements can be performed at a higher speed.

In addition, for example, three or more semiconductor substrates may bestacked, and, as illustrated in FIG. 16 described above, the globalcontrol circuit 13 may be arranged at two places, or the global controlcircuit 13 may be arranged at a plurality of places that are two or moreplaces. In this case, the semiconductor substrate in which a memory 61is arranged and the arrangement position or the number of divisions ofthe memory 61 may be appropriately laid out according to the arrangementof the global control circuit 13.

For example, a configuration may be employed in which the pixel arrayunit 12 is arranged in the semiconductor substrate of the first layer,the column ADC 15, the logic circuit 17, and the like are arranged inthe semiconductor substrate of the second layer, and the memory 61 isarranged in the semiconductor substrate of the third layer. Also in sucha configuration, by arranging the global control circuit 13 in thesemiconductor substrate of the second layer, while the wiring length canbe configured to be short, the global control circuit 13 may be arrangedin the semiconductor substrate in which the memory 61 is arranged.

<Eighth Configuration Example of Sensor Chip>

A sensor chip according to an eighth embodiment of the presenttechnology will be described with reference to FIGS. 26A to 26E. Notethat a same reference numeral will be assigned to a configuration commonto the sensor chip 11E illustrated in FIG. 14 among blocks configuringthe sensor chip 11G illustrated in FIGS. 26A to 26E, and detaileddescription thereof will not be presented.

In other words, the arrangement of a global control circuit 13 in thesensor chip 11 is not limited to that described in each embodimentdescribed above, but various layouts as illustrated in FIGS. 26A to 26Emay be employed. It is apparent that, in any arrangement, a layout notillustrated in the drawing may be employed as long as the global controlcircuit 13 is arranged along the long side of the pixel array unit 12.

As illustrated in FIG. 26A, a sensor chip 11G has a layout in which apixel array unit 12 and a global control circuit 13 are arranged in asensor substrate 51, and a rolling control circuit 14, a column ADC 15,and a logic circuit 17 are arranged in a logic substrate 52.

Furthermore, in the sensor chip 11G, the global control circuit 13 isarranged on the lower side of the pixel array unit 12 along the longside of the pixel array unit 12.

As illustrated in FIG. 26B, a sensor chip 11G-a has a layout in which apixel array unit 12 and a global control circuit 13 are arranged in asensor substrate 51, and a rolling control circuit 14, a column ADC 15,and a logic circuit 17 are arranged in a logic substrate 52.

Furthermore, in the sensor chip 11G-a, the global control circuit 13 isarranged on the upper side of the pixel array unit 12 along the longside of the pixel array unit 12.

As illustrated in FIG. 26C, a sensor chip 11G-b has a layout in which apixel array unit 12 and global control circuits 13-1 and 13-2 arearranged in a sensor substrate 51, and a rolling control circuit. 14, acolumn ADC 15, and a logic circuit 17 are arranged in a logic substrate52. Furthermore, in the sensor chip 11G-b, the global control circuits13-1 and 13-2 are respectively arranged on the upper side and the lowerside of the pixel array unit 12 along the long side of the pixel arrayunit 12.

As illustrated in FIG. 26D, a sensor chip 11G-c has a layout in which apixel array unit 12 and global control circuits 13-1 and 13-2 arearranged in a sensor substrate 51, and a rolling control circuit 14, acolumn ADC 15, and a logic circuit 17 are arranged in a logic substrate52. Furthermore, in the sensor chip 11G-c, the global control circuits13-1 and 13-2 are respectively arranged on the upper side and the lowerside of the pixel array unit 12 along the long side of the pixel arrayunit 12, and two control lines 21-1 and 21-2 are arranged to be separateat the center of a column of sensor elements arranged in the pixel arrayunit 12 in a matrix pattern.

As illustrated in FIG. 26E, a sensor chip 11G-d has a layout in which apixel array unit 12 and global control circuits 13-1 and 13-2 arearranged in a sensor substrate 51, and a rolling control circuit 14, acolumn ADC 15, and a logic circuit 17 are arranged in a logic substrate52. In the sensor chip 11G-d, an input/output unit 16 is arranged in thelogic substrate 52 along the long side of the pixel array unit 12.

For example, the sensor chip 11G-d is configured to supply power fromthe input/output unit 16 to the global control circuit 13 through a TSVarea 54-1 and a TSV area 53-1. Note that, instead of using TSVs, powermay be supplied to the global control circuit 13 by using a connectionbetween cooper (Cu) and copper configuring wires, micro bumps, or thelike. In addition, for a wiring supplying power to the global controlcircuit 13, the same connection method as that of the control line 21may be used or a connection method of a different combination may beused. In addition, other than the configuration in which semiconductorsubstrates of two layers are stacked, also in the case of aconfiguration in which semiconductor substrates of three layers arestacked, similarly, the global control circuit 13 is preferably arrangednear the input/output unit 16.

In addition, in the various layouts illustrated in FIGS. 26A to 26E,while examples in which the column ADC 15 is arranged on one side of thelogic substrate 52 are illustrated, a layout in which the column ADC 15is arranged on both upper and lower sides of the logic substrate 52 maybe employed. Here, the positions of the column ADC 15 and the logiccircuit 17 are not limited to those illustrated in the arrangement asillustrated in FIGS. 26A to 26E.

As above, by employing the stacking-type structure in the sensor chip11, the global control circuit 13 can be arranged in various layouts,and the degree of freedom of the layout is added, and an effect ofindividually controlling the global control circuit 13 and the rollingcontrol circuit 14 is increased.

<Configuration Example of Distance Image Sensor>

FIG. 27 is a block diagram that illustrates a configuration example of adistance image sensor that is an electronic apparatus using the sensorchip 11.

As illustrated in FIG. 27, the distance image sensor 201 is configuredto include an optical system 202, a sensor chip 203, an image processingcircuit 204, a monitor 205, and a memory 206. Furthermore, by receivinglight (modulated light or pulse light) that is projected from a lightsource device 211 toward an object and is reflected on the surface ofthe object, the distance image sensor 201 can acquire a distance imageaccording to a distance up to the object.

The optical system 202 is configured to include one or a plurality oflenses, guides image light (incident light) from an object to the sensorchip 203 and forms an image on a light receiving face (sensor unit) ofthe sensor chip 203.

As the sensor chip 203, the sensor chip 11 according to each embodimentdescribed above is applied, and a distance signal representing adistance acquired from a reception signal (APD OUT) output from thesensor chip 203 is supplied to the image processing circuit 204.

The image processing circuit 204 performs image processing for buildinga distance image on the basis of the distance signal supplied from thesensor chip 203, and the distance image (image data) acquired by theimage processing is supplied to a monitor 205 to be displayed thereon oris supplied to a memory 206 to be stored (recorded) therein.

In the distance image sensor 201 configured in this way, by applying thesensor chip 11 described above, control is performed at a higher speed,and accordingly, for example, a more accurate distance image can beacquired.

<Example of Use of Image Sensor>

FIG. 28 is a diagram that illustrates an example of a use for using theImage sensor (imaging device) described above.

The image sensor described above, for example, can be used for variouscases for sensing light such as visible light, infrared light,ultraviolet light, or an X ray as below.

Apparatus capturing an image provided for viewing such as a digitalcamera or a mobile apparatus provided with a camera function, or thelike

Apparatus provided for transportation such as an in-vehicle sensorimaging the front side, the rear side, the periphery, the inside, or thelike of a vehicle for safety driving such as vehicle stop, recognitionof the state of a driver, or the like, a monitoring camera monitoring atraveling vehicle or a road, a distance measurement sensor that measuresa distance between vehicles or the like

Apparatus provided for an electric appliance such as a television set, arefrigerator, or an air conditioner for capturing a user's gesture andoperating the electric appliance according to the gesture

Apparatus provided for a medical or healthcare use such as an endoscopeor an apparatus imaging blood vessels by receiving infrared light

Apparatus used for security such as a monitoring camera for security ora camera used for person authentication

Apparatus used for beauty such as a skin measurement apparatus imagingthe skin or a microscope imaging a scalp

Apparatus used for sports such as an action camera targeted for sportsor a wearable camera

Apparatus provided for agriculture such as a camera used for monitoringa field or the state of a crop

<Example of Application for Endoscope Operation System>

The technology (present technology) according to an embodiment of thepresent disclosure can be used for various products. For example, thetechnology according an embodiment of to the present disclosure may beapplied to an endoscope operation system.

FIG. 29 is a diagram that illustrates an example of a schematicconfiguration of an endoscope operation system according to anembodiment of the technology (present technology) relating to thepresent disclosure.

FIG. 29 illustrates an appearance in which an operator (doctor) 11131performs an operation for a patient 11132 positioned on a patient bed11133 by using the endoscope operation system 11000. As illustrated inthe drawing, the endoscope operation system 11000 is configured by anendoscope 11100, other operation tools 11110 such as a pneumoperitoneumtube 11111, an energy treatment tool 11112, and the like, a support armdevice 11120 supporting the endoscope 11100, and a cart 11200 in whichvarious devices used for an endoscope operation are mounted.

The endoscope 11100 is configured by a barrel 11101 of which an area ofa predetermined length from the tip end is inserted into a body cavityof a patient 11132 and a camera head 11102 connected to the base end ofthe barrel 11101. In the example illustrated in the drawing, while theendoscope 11100 configured by a so-called hard mirror having the barrel11101 having hardness is illustrated, the endoscope 11100 may beconfigured by a so-called soft mirror having a soft barrel.

At the tip end of the barrel 11101, an opening portion into which anobjective lens is inserted is formed. A light source device 11203 isconnected to the endoscope 11100, light generated by the light sourcedevice 11203 is guided up to the tip end of the barrel by using a lightguide disposed to extend to the inside of the barrel 11101 and isemitted toward an observation target disposed inside the body cavity ofthe patient 11132 through the objective lens. Here, the endoscope 11100may be a direct-viewing mirror or an oblique-viewing mirror, or aside-viewing mirror.

Inside the camera head 11102, an optical system and an imaging deviceare disposed, and reflection light (observation light) reflected from anobservation target is collected in the imaging device by the opticalsystem.

A photoelectric conversion of the observation light is performed by theimaging device, and an electrical signal corresponding to theobservation light, in other words, an image signal corresponding to anobserved image is generated. The image signal is transmitted to a cameracontrol unit (CCU) 11201 as raw data.

The CCU 11201 is configured by a central processing unit (CPU), agraphics processing unit (CPU), or the like and performs overall controlof the endoscope 11100 and the display device 11202. In addition, theCCU 11201 receives an image signal from the camera head 11102 andperforms various kinds of image processing used for displaying an imagebased on the image signal such as a developing process (demosaicprocessing) for the image signal.

The display device 11202 displays an image based on an image signal forwhich image processing has been performed by the CCU 11201 under thecontrol of the CCU 11201.

The light source device 11203, for example, is configured by a lightsource such as a light emitting diode (LED) or the like and suppliesemission light to the endoscope 11100 when an operating part or the likeis imaged.

The input device 11204 is an input interface for the endoscope operationsystem 11000. A user can input various kinds of information or input aninstruction to the endoscope operation system 11000 through the inputdevice 11204. For example, the user inputs an instruction indicating achange in imaging conditions (the kind of emission light, amagnification factor, a focal distance, and the like) of the endoscope11100 or the like.

The treatment tool control device 11205 controls the driving of theenergy treatment tool 11112 used for ablation or incision of a tissue,sealing blood vessels, or the like. The pneumoperitoneum device 11206transmits gas into the inside of a body cavity through thepneumoperitoneum tube 11111 so as to inflate the body cavity of thepatient 11132 for the purpose of the securement of a visual field usingthe endoscope 11100 and the securement of an operation space of anoperator.

The recorder 11207 is a device capable of recording various kinds ofinformation relating to an operation.

The printer 11208 is a device capable of printing various kinds ofinformation relating to an operation in any one of various forms such asa text, an image, and a graph.

In addition, the light source device 11203 that supplies emission lightat the time of causing the endoscope 11100 to image an operation part,for example, may be configured by an LED, a laser light source, or awhite light source configured by a combination thereof. In a case wherethe white light source is configured by a combination of RGB laser lightsources, since the output intensity and the output timing of each color(each wavelength) can be controlled with high accuracy, the adjustmentof the white balance of a captured image in the light source device11203 can be performed. In addition, in such a case, images respectivelycorresponding to RGB can be captured in a time-divisional manner byemitting laser light from the RGB laser light sources to an observationtarget in a time divisional manner and controlling the driving of theimaging device of the camera head 11102 in synchronization with theemission timing. According to this method, a color image can be acquiredwithout arranging any color filter in the imaging device.

In addition, the driving of the light source device 11203 may becontrolled to change the intensity of output light for everypredetermined time. By acquiring images in a time divisional manner bycontrolling the driving of the imaging device of the camera head 11102in synchronization with the timing of the change of the intensity oflight and composing the images, an image with a high dynamic range nothaving so-called black fullness and halation can be generated.

Furthermore, the light source device 11203 may be configured to supplylight of a predetermined wavelength band corresponding to special lightobservation. In the special light observation, for example, by usingwavelength dependency of light absorption in a body tissue, by emittinglight of a bandwidth narrower than that of the emission light (in otherwords, white light) at the time of normal observation, so-called narrowband imaging for imaging a predetermined tissue such as blood vessels ofa mucous membrane surface layer with high contrast is performed.Alternatively, in the special light observation, fluorescenceobservation for acquiring an image using fluorescent light generated byemitting excitation light may be performed. In the fluorescenceobservation, observation of fluorescent light from a body tissue afteremitting excitation light to the body tissue (self-fluorescenceobservation), acquisition of a fluorescent image acquired by performinglocal injection of a reagent such as indocyanine green (ICG) into a bodytissue and emitting excitation light corresponding to the florescencewavelength corresponding to the reagent, or the like may be performed.The light source device 11203 may be configured to supply narrow-bandlight and/or excitation light corresponding to such special lightobservation.

FIG. 30 is a block diagram that illustrates an example of the functionalconfigurations of the camera head 11102 and the CCU 11201 illustrated inFIG. 29.

The camera head 11102 includes a lens unit 11401, an imaging unit 11402,a driving unit 11403, a communication unit 11404, and a camera headcontrol unit 11405. The CCU 11201 includes a communication unit 11411,an image processing unit 11412, and a control unit 11413. The camerahead 11102 and the CCU 11201 are connected to be communicable with eachother through a transmission cable 11400.

The lens unit 11401 is an optical system disposed in a connectionportion for the barrel 11101. Observation light received from the tipend of the barrel 11101 guided up to the camera head 11102 and isincident to the lens unit 11401. The lens unit 11401 is configured bycombining a plurality of lenses including a zoom lens and a focus lens.

The imaging unit 11402 is configured by an imaging device.

The number of the imaging devices configuring the imaging unit 11402 maybe one (so-called one plate type) or two or more (so-called multi-platetype). In a case where the imaging unit 11402 is configured as amulti-plate type, for example, image signals corresponding to RGB may begenerated by the imaging devices, and a color image may be acquired bycomposing the image signals.

Alternatively, the imaging unit 11402 may be configured to include oneimaging device used for acquiring an image signal for each of the righteye and the left eye corresponding to three-dimensional (3D) display. Byperforming the 3D display, the operator 11131 can perceive the depth ofa body tissue in an operation part more accurately. In addition, in acase where the imaging unit 11402 is configured as the multi-plate type,a plurality of systems of lens units 11401 may be disposed incorrespondence with imaging devices.

In addition, the imaging unit 11402 may not necessarily be disposed inthe camera head 11102. For example, the imaging unit 11402 may bedisposed immediately after the objective lens inside the barrel 11101.

The driving unit 11403 is configured by an actuator and moves the zoomlens and the focus lens of the lens unit 11401 along the optical axis bya predetermined distance under the control of the camera head controlunit 11405.

Accordingly, the magnification factor and the focal point of a capturedimage acquired by the imaging unit 11402 can be appropriately adjusted.

The communication unit 11404 is configured by a communication deviceused for transmitting/receiving various kinds of information to/from theCCU 11201. The communication unit 11404 transmits an image signalacquired from the imaging unit 11402 to the CCU 11201 through atransmission cable 11400 as raw data.

In addition, the communication unit 11404 receives a control signal usedfor controlling the driving of the camera head 11102 from the CCU 11201and supplies the received control signal to the camera head control unit11405. In the control signal, for example, information relating toimaging conditions such as information indicating designation of a framerate of a captured image and information indicating designation of anexposure value at the time of imaging and/or information indicatingdesignation of a magnification factor and a focal point of a capturedimage is included.

Note that the imaging conditions such as a frame rate, an exposurevalue, a magnification factor, and a focal point described above may beappropriately designated by a user or be automatically set by thecontrol unit 11413 of the CCU 11201 on the basis of the acquired imagesignal. In the latter case, so-called an auto exposure (AE) function, anauto focus (AF) function, and an auto white balance (AWB) function aremounted in the endoscope 11100.

The camera head control unit 11405 controls the driving of the camerahead 11102 on the basis of a control signal supplied from the CCU 11201that has been received through the communication unit 11404.

The communication unit 11411 is configured by a communication deviceused for transmitting/receiving various kinds of information to/from thecamera head 11102. The communication unit 11411 receives an image signaltransmitted from the camera head 11102 through the transmission cable11400.

In addition, the communication unit 11411 transmits a control signalused for controlling the driving of the camera head 11102 to the camerahead 11102. The image signal and the control signal may be transmittedthrough electric communication, optical communication, or the like.

The image processing unit 11412 performs various kinds of imageprocessing for the image signal that is raw data transmitted from thecamera head 11102.

The control unit 11413 performs various kinds of control relating to theimaging of an operation part or the like using the endoscope 11100 anddisplay of a captured image acquired by imaging the operation part orthe like. For example, the control unit 11413 generates a control signalused for controlling the driving of the camera head 11102.

In addition, the control unit 11413 displays a captured image in whichthe operation part or the like is projected on the display device 11202on the basis of an image signal for which image processing has beenperformed by the image processing unit 11412. At this time, the controlunit 11413 may recognize various objects within the captured image byusing various image recognition technologies. For example, the controlunit 11413 may recognize an operation tool such as forceps, a specificregion of a living body, bleeding, mist at the time of using the energytreatment tool 11112 and the like by detecting the shapes, the colors,and the like of edges of objects included in the captured image. When acaptured image is displayed in the display device 11202, the controlunit 11413 may superimpose various kinds of operation supportinformation on an image of the operation part by using a result of therecognition. By causing the operation support information to bedisplayed in a superimposing manner and be presented to the operator11131, the burden of the operator 11131 can be reduced, or the operator11131 can process an operation more reliably.

The transmission cable 11400 connecting the camera head 11102 and theCCU 11201 is an electric signal cable corresponding to the communicationof an electrical signal, an optical fiber corresponding to opticalcommunication, or a composite cable thereof.

In the example illustrated here, while wired communication using thetransmission cable 11400 is performed, the communication between thecamera head 11102 and the CCU 11201 may be wirelessly performed.

As above, an example of the endoscope operation system according to anembodiment or the technology relating to the present disclosure has beendescribed. The technology relating to the present disclosure, forexample, may be applied to the endoscope 11100, the camera head 11102(the imaging unit 11402 thereof), the CCU 11201 (the image processingunit 11412 thereof), and the like among the configurations describedabove.

Here, while the endoscope operation system has been described as anexample, the technology relating to the present disclosure, for example,may be applied to a microscope operation system or the like other thanthe endoscope operation system.

<Example of Application for Mobile Body>

The technology (present technology) relating to the present disclosurecan be applied to various products.

For example, the technology relating to the present disclosure may berealized as an apparatus mounted on a mobile body of one of a car, anelectric car, a hybrid electric car, an auto bicycle, a bicycle, apersonal mobility, an airplane, a Drone, a ship, a robot, and the like.

FIG. 31 is a block diagram that illustrates an example of a schematicconfiguration of a vehicle control system that is an example of a mobilebody control system according to an embodiment of the technologyrelating to the present disclosure.

The vehicle control system 12000 includes a plurality of electroniccontrol units connected through a communication network 12001. In theexample illustrated in FIG. 31, the vehicle control system 12000includes a driving system control unit 12010, a body system control unit12020, a vehicle external information detecting unit 12030, a vehicleinternal information detecting unit 12040, and an integrated controlunit 12050. In addition, as the functional configurations of theintegrated control unit 12050, a microcomputer 12051, an audio/videooutput unit 12052, and an in-vehicle network interface (I/F) 12053 areillustrated.

The driving system control unit 12010 controls the operations of devicesrelating to the driving system of the vehicle in accordance with variousprograms. For example, the driving system control unit 12010 functionsas a control device of a driving force generating device used forgenerating a driving force of a vehicle such as an internal-combustionengine or a driving motor, a driving force delivery mechanism used fordelivering a driving force to vehicle wheels, a steering mechanismadjusting the steering angle of the vehicle, a braking device generatinga braking force of the vehicle, and the like.

The body system control unit 12020 controls the operations of variousdevices mounted in a vehicle body in accordance with various programs.For example, the body system control unit 12020 functions as a controldevice of a keyless entry system, a smart keying system, a power windowdevice, various lamps such as a head lamp, a back lamp, a brake lamp, ablinker, and a fog lamp, or the like. In this case, an electric wavetransmitted from a mobile device replacing a key or signals of variousswitches may be input to the body system control unit 12020. The bodysystem control unit 12020 receives the input of such waves and signalsand controls the door lock device, the power window device, the lamps,and the like of the vehicle.

The vehicle external information detecting unit 12030 detects externalinformation of a vehicle on which the vehicle control system 12000 ismounted. For example, the imaging unit 12031 is connected to the vehicleexternal information detecting unit 12030. The vehicle externalinformation detecting unit 12030 causes the imaging unit 12031 tocapture an image of the outside of the vehicle and receives the capturedimage. The vehicle external information detecting unit 12030 may performan object detecting process for a person, a car, an obstacle, a sign ora character on the road or a distance detecting process on the basis ofthe received image.

The imaging unit 12031 is an optical sensor that receives light andoutputs an electrical signal according to the amount of received light.The imaging unit 12031 can output an electric signal as an image or asinformation of a measured distance. In addition, the light received bythe imaging unit 12031 may be visible light or non-visible light such asinfrared light.

The vehicle internal information detecting unit 12040 detectsinformation of the inside of the vehicle. For example, a driver statedetecting unit 12041 detecting the state of a driver is connected to thevehicle internal information detecting unit 12040. For example, thedriver state detecting unit 12041 may include a camera that images adriver, and the vehicle internal information detecting unit 12040, onthe basis of detection information input from the driver state detectingunit 12041, may calculate the degree of fatigue or the degree ofconcentration of a driver or may determine whether a driver is nappingin the seat.

The microcomputer 12051 can calculate a control target value of thedriving force generating device, the steering mechanism, or the brakingdevice on the basis of the vehicle internal/external informationacquired by the vehicle external information detecting unit 12030 or thevehicle internal information detecting unit 12040 and output a controlinstruction to the driving system control unit 12010. For example, themicrocomputer 12051 can perform cooperative control for the purpose ofrealization of the function of an advanced driver assistance system(ADAS) including collision avoidance or shock alleviation of a vehicle,following running based on an inter-vehicle distance, vehicle speedmaintaining running, a vehicle collision warning, a vehicle lanedeparture warning, and the like.

In addition, the microcomputer 12051 can perform cooperative control forthe purpose of automatic driving for autonomously running withoutdepending on the operation of a driver or the like by controlling thedriving force generating device, the steering mechanism, the brakingdevice, or the like on the basis of information of the periphery of thevehicle acquired by the vehicle external information detecting unit12030 or the vehicle internal information detecting unit 12040.

In addition, the microcomputer 12051 can output a control instruction tothe body system control unit 12020 on the basis of the information ofthe outside of the vehicle acquired by the vehicle external informationdetecting unit 12030. For example, the microcomputer 12051 can performcooperative control for the purpose of achieving antiglare such asswitching a high beam to a low beam by controlling a head lamp inaccordance with the position of a preceding car or an oncoming cardetected by the vehicle external information detecting unit 12030 or thelike.

The audio/video output unit 12052 transmits an output signal of at leastone of an audio and a video to an output device capable of visually oracoustically notifying passenger of the vehicle or the outside of thevehicle of information. In the example illustrated in FIG. 31, an audiospeaker 12061, a display unit 12062, and an instrument panel 12063 areillustrated as examples of the output device. The display unit 12062,for example, may include at least one of an onboard display and ahead-up display.

FIG. 32 is a diagram that illustrates an example of the installationposition of the imaging unit 12031.

As illustrated in FIG. 32, a vehicle 12100 includes imaging units 12101,12102, 12103, 12104, and 12105 as the imaging unit 12031.

The imaging units 12101, 12102, 12103, 12104, and 12105, for example,are installed at positions such that the front nose, the side mirror,the rear bumper, and the back door of the vehicle 12100, and an upperpart of front glass inside the vehicle cabin, and the like. The imagingunit 12101 provided at the front nose and the imaging unit 12105provided at the upper part of the front glass inside the vehicle cabinmainly acquire images of the front side of the vehicle 12100. Theimaging units 12102 and 12103 provided at the side mirrors mainlyacquire images of the sides of the vehicle 12100. The imaging unit 12104provided at the rear bumper or the back door mainly acquires images ofthe rear sides of the vehicle 12100. The images of the front sidesacquired by the imaging units 12101 and 12105 are mainly used fordetection of a preceding vehicle, a pedestrian, an obstacle, a trafficlamp, a traffic sign, a vehicle lane, and the like.

Note that FIG. 32 illustrates an example of the imaging ranges of theimaging units 12101 to 12104. The imaging range 12111 illustrates animaging range of the imaging unit 12101 installed at the front nose, theimaging ranges 12112 and 12113 respectively illustrate the imagingranges of the imaging units 12102 and 12103 installed at the sidemirrors, and the imaging range 12114 illustrates the imaging range ofthe imaging unit 12104 installed at the rear bumper or the back door.For example, by superimposing image data imaged by the imaging units12101 to 12104, a bird's eye view image acquired by viewing the vehicle12100 from the upper side is acquired.

At least one of the imaging units 12101 to 12104 may have a function foracquiring distance information. For example, at least one of the imagingunits 12101 to 12104 may be a stereo camera formed by a plurality ofimaging devices or an imaging device including a pixel used fordetecting a phase difference.

For example, the microcomputer 12051 can extract a solid object that isthe closest solid object present on a traveling road of the vehicle12100 and travels at a predetermined speed (for example, 0 km/h or more)in an approximately same direction as that of the vehicle 12100 as apreceding car by acquiring a distance up to each solid object in theimaging ranges 12111 to 12114 and a change (a relative speed withrespect to the vehicle 12100) of the distance with respect to time onthe basis of distance information acquired from the imaging units 12101to 12104. In addition, the microcomputer 12051 may set an inter-vehicledistance to be secured before a preceding car in advance and performautomatic brake control (including following stop control), automaticacceleration control (including following start control), and the like.In this way, cooperative control for the purpose of automatic drivingfor autonomous traveling without depending on an operation of the driverand the like can be performed.

For example, the microcomputer 12051 can classify solid object datarelating to solid objects into two-wheel vehicles, ordinary vehicles,large-size vehicles, pedestrians, electric poles, and the other solidobjects and extracts the solid objects on the basis of the distanceinformation acquired by the imaging units 12101 to 12104 and use theextracted solid objects for automatic avoidance of obstacle objects. Forexample, the microcomputer 12051 classifies obstacles present on theperiphery of the vehicle 12100 as obstacles that can be visuallyrecognized by the driver of the vehicle 12100 and obstacles that aredifficult to visually recognize for the driver. Then, the microcomputer12051 can determine a collision risk representing the degree of risk fora collision with each obstacle and, when a situation in which thecollision risk has a collision possibility higher than a set value isformed, outputs a warning signal to the driver through the audio speaker12061 or the display unit 12062 and performs forced deceleration oravoidance steering through the driving system control unit 12010,thereby performing driving support for avoiding collisions.

At least one of the imaging units 12101 to 12104 may be an infraredcamera detecting infrared light. For example, the microcomputer 12051can recognize a pedestrian by determining whether or not a pedestrian ispresent in captured images acquired by the imaging units 12101 to 12104.The recognition of a pedestrian, for example, may be performed by asequence in which feature points in the captured images acquired by theimaging units 12101 to 12104 as infrared cameras are extracted and asequence in which it is determined whether or not an object is apedestrian by performing a pattern matching process for a series offeature points representing the contour of the object. When themicrocomputer 12051 determines that a pedestrian is present in thecaptured images acquired by the imaging units 12101 to 12104 andrecognizes the pedestrian, the audio/video output unit 12052 performscontrol of the display unit 12062 to display a rectangular contour usedfor an emphasis to be superimposed on the recognized pedestrian. Inaddition, the audio/video output unit 12052 may perform control of thedisplay unit 12062 such that an icon or the like representing thepedestrian is displayed at a desired position.

As above, an example of the vehicle control system according to anembodiment of the technology relating to the present disclosure has beendescribed. The technology relating to the present disclosure can beapplied to the imaging unit 12031 or the like among the configurationsdescribed above.

<Example of Combination of Configurations>

In addition, the present technology can take the followingconfigurations as well.

(1)

A sensor chip including:

a pixel array unit that has a rectangular-shaped area in which aplurality of sensor elements are arranged in an array pattern; and

a global control circuit, in which driving elements simultaneouslydriving the sensor elements are arranged in one direction, and each ofthe driving elements is connected to a control line disposed for eachone column of the sensor elements, that is arranged to have alongitudinal direction to be along a long side of the pixel array unit.

(2)

The sensor chip according to (1),

in which two global control circuits are arranged on both sides of thepixel array unit along a longitudinal direction of the pixel array unit,and

the driving elements of each of the global control circuits areconnected to both ends of the control line.

(3)

The sensor chip according to (2),

in which the signal line arranged for each one column of the sensorelements is divided at approximate center of the pixel array unit, and

among the driving elements of the two global control circuits arrangedon both sides of the pixel array unit,

the driving elements of one side are connected to the divided signalline of one side, and the driving elements of the other side areconnected to the divided signal line of the other side.

(4)

The sensor chip according to any of (1) to (3), in which the sensor chiphas a stacking structure in which a sensor substrate in which the pixelarray unit is arranged and a logic substrate in which the global controlcircuit is arranged are stacked.

(5)

The sensor chip according to any of (1) to (4), in which the drivingelements arranged in the global control circuit of the logic substrateare connected to a one end portion of the signal line through aconnection portion disposed on a periphery of an area in which the pixelarray unit is arranged in the sensor substrate.

(6)

The sensor chip according to any of (1) to (4),

in which two global control circuits are arranged in the logic substratein correspondence with both sides of the pixel array unit along alongitudinal direction of the pixel array unit, and

the driving elements arranged in the two global control circuitsarranged in the logic substrate are connected to both end portions ofthe signal line through connection portions disposed on both sides,facing each other, on the periphery of the area in which the pixel arrayunit is arranged in the sensor substrate.

(7)

The sensor chip according to any of (1) to (4),

in which a signal line arranged for each one column of the sensorelements is divided at approximate center of the pixel array unit, and

among the driving elements of the two global control circuits arrangedin the logic substrate in correspondence with both sides of the pixelarray unit respectively, the driving elements of one side are connectedto the divided signal line of one side, and the driving elements of theother side are connected to the divided signal line of the other side.

(8)

The sensor chip according to any of (1) to (4), in which the globalcontrol circuit is arranged at approximate center of the logicsubstrate, and the driving elements arranged in the global controlcircuit of the logic substrate are connected to approximate center ofthe signal line through a connection portion disposed to overlap thepixel array unit in a plan view.

(9)

The sensor chip according to any of (1) to (4),

in which a signal line arranged for each one column of the sensorelements is divided at approximate center of the pixel array unit, and

two driving elements are arranged for each one column of the sensorelements in the global control circuit, the driving elements of one sideare connected to an end portion of a center side of the pixel array unitof the signal line of one side, and the driving elements of the otherside are connected to an end portion of the center side of the pixelarray unit of the signal line of the other side.

(10)

The sensor chip according to any of (1) to (4), in which the two globalcontrol circuits are arranged in the logic substrate, the drivingelements of one of the global control circuits are connected to centerof one half portion of the signal line of one side, and the drivingelements of the other of the global control circuits are connected tocenter of one half portion of the signal line of the other side.

(11)

The sensor chip according to any of (1) to (4),

in which the signal line arranged for each one column of the sensorelements is divided at approximate center of the pixel array unit, and

the two global control circuits are arranged in the logic substrate, thedriving elements of one of the global control circuits are connected tocenter of the signal line of one side, and the driving elements of theother global control circuit are connected to center of the signal lineof the other side.

(12)

The sensor chip according to (11), in which the signal line is dividedinto three or more signal lines, and the driving elements ofcorresponding three or more global control circuits are connected atapproximate center of the signal lines.

(13)

The sensor chip according to any of (1) to (12), in which the signalline is divided into a plurality of parts, at least one global controlcircuit is arranged in the logic substrate, and a plurality of buffercircuits corresponding to the division number of the signal line arearranged.

(14)

The sensor chip according to any of (1) to (12), in which the sensorchip is configured by stacking three or more semiconductor substrates.

(15)

An electronic apparatus including a sensor chip including:

a pixel array unit that has a rectangular-shaped area in which aplurality of sensor elements are arranged in an array pattern; and

a global control circuit, in which driving elements simultaneouslydriving the sensor elements are arranged in one direction, and each ofthe driving elements is connected to a control line disposed for eachone column of the sensor elements, that is arranged to have alongitudinal direction to be along a long side of the pixel array unit.

Note that an embodiment is not limited to the embodiments describedabove, but various changes can be made in a range not departing from theconcept of the present disclosure. In addition, effects described hereare merely examples, and the effect is not limited thereto, and thus,any other effect may be acquired.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

REFERENCE SIGNS LIST

-   11 Sensor chip-   12 Pixel array unit-   13 Global control circuit-   14 Rolling control circuit-   15 Column ADC-   16 Input/output unit-   17 Logic circuit-   21 Control line-   31 Internal buffer-   32 Driving element-   41 and 42 Internal buffer-   43 Register-   44 Driving element-   45 Decoder-   46 AND gate-   51 Sensor substrate-   52 Logic substrate-   53 and 54 TSV area-   55 Buffer circuit-   61 Memory

The invention claimed is:
 1. A sensor chip comprising: a pixel arrayunit that has a rectangular-shaped area in which a plurality of sensorelements are arranged in an array pattern; and a global control circuit,in which driving elements simultaneously driving the sensor elements arearranged in one direction, and each of the driving elements is connectedto a control line disposed for each one column of the sensor elements,that is arranged to have a longitudinal direction to be along a longside of the pixel array unit.
 2. The sensor chip according to claim 1,wherein two global control circuits are arranged on both sides of thepixel array unit along a longitudinal direction of the pixel array unit,and the driving elements of each of the global control circuits areconnected to both ends of the control line.
 3. The sensor chip accordingto claim 2, wherein the control line arranged for each one column of thesensor elements is divided at approximate center of the pixel arrayunit, and among the driving elements of the two global control circuitsarranged on both sides of the pixel array unit, the driving elements ofone side are connected to the divided control line of one side, and thedriving elements of the other side are connected to the divided controlline of the other side.
 4. The sensor chip according to claim 1, whereinthe sensor chip has a stacking structure in which a sensor substrate inwhich the pixel array unit is arranged and a logic substrate in whichthe global control circuit is arranged are stacked.
 5. The sensor chipaccording to claim 4, wherein the driving elements arranged in theglobal control circuit of the logic substrate are connected to a one endportion of the control line through a connection portion disposed on aperiphery of an area in which the pixel array unit is arranged in thesensor substrate.
 6. The sensor chip according to claim 4, wherein twoglobal control circuits are arranged in the logic substrate incorrespondence with both sides of the pixel array unit along alongitudinal direction of the pixel array unit, and the driving elementsarranged in the two global control circuits arranged in the logicsubstrate are connected to both end portions of the control line throughconnection portions disposed on both sides, facing each other, on theperiphery of the area in which the pixel array unit is arranged in thesensor substrate.
 7. The sensor chip according to claim 4, wherein thecontrol line arranged for each one column of the sensor elements isdivided at approximate center of the pixel array unit, and among thedriving elements of the two global control circuits arranged in thelogic substrate in correspondence with both sides of the pixel arrayunit respectively, the driving elements of one side are connected to thedivided control line of one side, and the driving elements of the otherside are connected to the divided control line of the other side.
 8. Thesensor chip according to claim 4, wherein the global control circuit isarranged at approximate center of the logic substrate, and the drivingelements arranged in the global control circuit of the logic substrateare connected to approximate center of the control line through aconnection portion disposed to overlap the pixel array unit in a planview.
 9. The sensor chip according to claim 4, wherein the control linearranged for each one column of the sensor elements is divided atapproximate center of the pixel array unit, and two driving elements arearranged for each one column of the sensor elements in the globalcontrol circuit, the driving elements of one side are connected to anend portion of a center side of the pixel array unit of the control lineof one side, and the driving elements of the other side are connected toan end portion of the center side of the pixel array unit of the controlline of the other side.
 10. The sensor chip according to claim 4,wherein the two global control circuits are arranged in the logicsubstrate, the driving elements of one of the global control circuitsare connected to center of one half portion of the control line of oneside, and the driving elements of the other of the global controlcircuits are connected to center of one half portion of the control lineof the other side.
 11. The sensor chip according to claim 4, wherein thecontrol line arranged for each one column of the sensor elements isdivided at approximate center of the pixel array unit, and the twoglobal control circuits are arranged in the logic substrate, the drivingelements of one of the global control circuits are connected to centerof the control line of one side, and the driving elements of the otherglobal control circuit are connected to center of the control line ofthe other side.
 12. The sensor chip according to claim 11, wherein thecontrol line is divided into three or more control lines, and thedriving elements of corresponding three or more global control circuitsare connected at approximate center of the control lines.
 13. The sensorchip according to claim 12, wherein the control line is divided into aplurality of parts, at least one global control circuit is arranged inthe logic substrate, and a plurality of buffer circuits corresponding tothe division number of the control line are arranged.
 14. The sensorchip according to claim 4, wherein the sensor chip is configured bystacking three or more semiconductor substrates.
 15. An electronicapparatus including a sensor chip comprising: a pixel array unit thathas a rectangular-shaped area in which a plurality of sensor elementsare arranged in an array pattern; and a global control circuit, in whichdriving elements simultaneously driving the sensor elements are arrangedin one direction, and each of the driving elements is connected to acontrol line disposed for each one column of the sensor elements, thatis arranged to have a longitudinal direction to be along a long side ofthe pixel array unit.